A plaque remaining from the Big Apple Night Club at West 135th Street and Seventh Avenue in Harlem.

Above, a 1934 plaque from the Big Apple Night Club at West 135th Street and Seventh Avenue in Harlem. Discarded as trash in 2006.

Recent entries:
“A friend of wine is a friend of mine” (4/25)
“The first thing on my bucket list is to fill the bucket with wine” (4/24)
“I’m a wine enthusiast. The more wine I drink, the more enthusiastic I become” (4/24)
“Homemade with love. In other words, I licked the spoon and kept using it” (4/24)
“Uncork and unwind” (wine saying) (4/24)
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Entry from May 29, 2006
Manhattan Skyline (Tombstoning)
"Tombstoning" is also sometimes called "Manhattan skyline." It is when pieces stand up vertically (like a "tombstone" or the "Manhattan skyline") and they chip off. The term is used in electronics.

http://www.tkb-4u.com/articles/other/tombstoning/tombstoning.php

http://home.tiscali.nl/markvandemoosdijk/Electronics/Art/TombStone/TombstoningCauses.htm

What is Tombstoning?
A tombstone-sometimes called a Manhattan skyline, crocodile, leaning tower or space rocket-is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by solderability variations on terminations; volume of paste; surface area of pad; variations in thermal demand of pads; solder mask thickness; paste under parts; limited placement force; and nitrogen usage.

To understand how tombstoning can occur, watch the reflow process. A small board can be printed, placed and reflowed, on a hot plate or under a rework station, simulating the conditions of the reflow process. If you are lucky, you will see the component lift. As components get smaller, the surface of the wettable area of the parts becomes significant and can develop high surface tension forces during reflow. The lifting of parts is becoming more of a problem as products continue to be miniaturized.

http://www.bobwillis.co.uk/ppm/defects/Reflow/html/..%5CPDF%5CCl32tf.pdf
This defect is often referred to as tombstoning, draw bridging or Manhattan skyline, particularly if there are many parts all standing vertically. The defect is caused by uneven wetting where one termination solders before the second causing the surface tension of the solder to pull the device in one direction. It can be exaggerated by the amount of paste on small parts, 0805 chips and below or incorrect pad sizes increasing movement during reflow.

Posted by Barry Popik
Names/Phrases • (0) Comments • Monday, May 29, 2006 • Permalink